JPH0513542B2 - - Google Patents
Info
- Publication number
- JPH0513542B2 JPH0513542B2 JP62302603A JP30260387A JPH0513542B2 JP H0513542 B2 JPH0513542 B2 JP H0513542B2 JP 62302603 A JP62302603 A JP 62302603A JP 30260387 A JP30260387 A JP 30260387A JP H0513542 B2 JPH0513542 B2 JP H0513542B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- well
- potential detection
- substrate potential
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
- H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
- H10D84/85—Complementary IGFETs, e.g. CMOS
- H10D84/859—Complementary IGFETs, e.g. CMOS comprising both N-type and P-type wells, e.g. twin-tub
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/27—Testing of devices without physical removal from the circuit of which they form part, e.g. compensating for effects surrounding elements
- G01R31/275—Testing of devices without physical removal from the circuit of which they form part, e.g. compensating for effects surrounding elements for testing individual semiconductor components within integrated circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/145—Indicating the presence of current or voltage
- G01R19/155—Indicating the presence of voltage
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
- H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/60—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
- H10D84/67—Complementary BJTs
- H10D84/673—Vertical complementary BJTs
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62302603A JPH01144667A (ja) | 1987-11-30 | 1987-11-30 | 基板電位検出回路 |
DE8888119715T DE3880635T2 (de) | 1987-11-30 | 1988-11-25 | Substratpotentialdetektionsschaltung. |
EP88119715A EP0318869B1 (en) | 1987-11-30 | 1988-11-25 | Substrate potential detecting circuit |
CA000584287A CA1300281C (en) | 1987-11-30 | 1988-11-28 | Substrate potential detecting circuit |
MYPI88001378A MY103799A (en) | 1987-11-30 | 1988-11-28 | Substrate potential detecting circuit |
KR1019880015886A KR910009804B1 (ko) | 1987-11-30 | 1988-11-30 | 기판전위검출회로 |
US07/523,178 US4980745A (en) | 1987-11-30 | 1990-05-15 | Substrate potential detecting circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62302603A JPH01144667A (ja) | 1987-11-30 | 1987-11-30 | 基板電位検出回路 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01144667A JPH01144667A (ja) | 1989-06-06 |
JPH0513542B2 true JPH0513542B2 (en]) | 1993-02-22 |
Family
ID=17910968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62302603A Granted JPH01144667A (ja) | 1987-11-30 | 1987-11-30 | 基板電位検出回路 |
Country Status (7)
Country | Link |
---|---|
US (1) | US4980745A (en]) |
EP (1) | EP0318869B1 (en]) |
JP (1) | JPH01144667A (en]) |
KR (1) | KR910009804B1 (en]) |
CA (1) | CA1300281C (en]) |
DE (1) | DE3880635T2 (en]) |
MY (1) | MY103799A (en]) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2953755B2 (ja) * | 1990-07-16 | 1999-09-27 | 株式会社東芝 | マスタスライス方式の半導体装置 |
US5250834A (en) * | 1991-09-19 | 1993-10-05 | International Business Machines Corporation | Silicide interconnection with schottky barrier diode isolation |
KR20160133113A (ko) | 2015-05-12 | 2016-11-22 | 김금녀 | 음성 안내 매트 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE7145628U (de) * | 1970-12-10 | 1972-03-16 | Motorola Inc | Integrierter transistor mit saettigungsanzeiger |
US3720848A (en) * | 1971-07-01 | 1973-03-13 | Motorola Inc | Solid-state relay |
US4336489A (en) * | 1980-06-30 | 1982-06-22 | National Semiconductor Corporation | Zener regulator in butted guard band CMOS |
US4628340A (en) * | 1983-02-22 | 1986-12-09 | Tokyo Shibaura Denki Kabushiki Kaisha | CMOS RAM with no latch-up phenomenon |
US4823314A (en) * | 1985-12-13 | 1989-04-18 | Intel Corporation | Integrated circuit dual port static memory cell |
US4829359A (en) * | 1987-05-29 | 1989-05-09 | Harris Corp. | CMOS device having reduced spacing between N and P channel |
-
1987
- 1987-11-30 JP JP62302603A patent/JPH01144667A/ja active Granted
-
1988
- 1988-11-25 DE DE8888119715T patent/DE3880635T2/de not_active Expired - Fee Related
- 1988-11-25 EP EP88119715A patent/EP0318869B1/en not_active Expired - Lifetime
- 1988-11-28 MY MYPI88001378A patent/MY103799A/en unknown
- 1988-11-28 CA CA000584287A patent/CA1300281C/en not_active Expired - Lifetime
- 1988-11-30 KR KR1019880015886A patent/KR910009804B1/ko not_active Expired
-
1990
- 1990-05-15 US US07/523,178 patent/US4980745A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CA1300281C (en) | 1992-05-05 |
JPH01144667A (ja) | 1989-06-06 |
EP0318869A1 (en) | 1989-06-07 |
EP0318869B1 (en) | 1993-04-28 |
US4980745A (en) | 1990-12-25 |
KR910009804B1 (ko) | 1991-11-30 |
DE3880635T2 (de) | 1993-08-05 |
DE3880635D1 (de) | 1993-06-03 |
KR890008977A (ko) | 1989-07-13 |
MY103799A (en) | 1993-09-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7018889B2 (en) | Latch-up prevention for memory cells | |
JP3228583B2 (ja) | 半導体集積回路装置 | |
US20010009383A1 (en) | Semiconductor integrated circuit and its fabrication method | |
EP0080361B1 (en) | Complementary metal-oxide semiconductor integrated circuit device of master slice type | |
EP0177336B1 (en) | Gate array integrated device | |
US5302871A (en) | Delay circuit | |
US4468574A (en) | Dual gate CMOS transistor circuits having reduced electrode capacitance | |
JP2822781B2 (ja) | マスタスライス方式半導体集積回路装置 | |
US20060128090A1 (en) | Latch-up prevention for memory cells | |
JPH0318347B2 (en]) | ||
JPH0513542B2 (en]) | ||
JPS612342A (ja) | 半導体集積回路装置 | |
JPS60154553A (ja) | 相補型mos集積回路の駆動方法 | |
JP2852051B2 (ja) | 相補型クロックドナンド回路 | |
JPS62263653A (ja) | 半導体集積回路装置の製造方法 | |
JPH0532908B2 (en]) | ||
JPH0427159A (ja) | 半導体装置 | |
JPH0420117A (ja) | 半導体集積回路 | |
JP2992073B2 (ja) | 出力回路及びその製造方法 | |
JPH0677442A (ja) | 半導体集積回路の製造方法 | |
JPH07297290A (ja) | 半導体集積回路装置 | |
JPS585611B2 (ja) | ロンリカイロ | |
JPS6029255B2 (ja) | 論理回路 | |
JPH023950A (ja) | 半導体集積回路スタンダードセル | |
JPH01125952A (ja) | マスタスライス集積回路 |